Low-Cost Coating Solution
-
High yield rate with excellent IC support and vicarious reinforcement.
Customized Cover Lens Solution
-
Offers good scratch resistance, supports various industrial designs.
-
Moh’s hardness of 6-7, excellent chemical resistance, and a wide range of color options.
Non-Hole Underglass Solution
-
Maintains strength without any loss, offering good uniformity.
-
Compared to CNC drilling, etching forming technology is more efficient, provides better hole flatness, and offers cost advantages.
Integrated Design COG Solution
-
Represents the future trend with high integration.
-
Attaching the sensor layer directly to the protective cover reduces the fingerprint module’s thickness, making the overall design more flexible. This approach may enable full-screen fingerprint identification in the future.
No loss of strength, integrated design, and excellent waterproof performance.
No drilling on the cover lens. The integrated design provides a sleek and aesthetically pleasing front appearance, enhanced dustproof and waterproof capabilities, along with superior ball drop resistance and shock resistance compared to solutions with holes.
Blind holes are created using a chemical etching method. This eliminates micro-cracks, providing a stronger solution than CNC drilling.
Stronger tolerance control than CNC methods ensures better module uniformity. Additionally, this method is more cost-effective, efficient, and easier to mass-produce.
Underglass Solutions:
Sided blind hole
Positive blind hole
Back blind hole
Convex concave
Applications: These solutions can be applied in smart terminals such as smartphones, automotive systems, the Internet of Things (IoT), industrial devices, medical equipment, and more.
